IPSR-INTERNATIONAL 2026 SPRING MEETING

The IPSR-International, the Integrated Photonics System Roadmap promotes synchronous, self-consistent solutions for the electronic-photonic manufacturing value chain. Co-Packaged Optics (CPO) represents the first driver for E-P integration with High Volume Manufacturing compatibility. The charter for this meeting is assessment of roadblocks and potential solutions for a scalable, HVM package platform development plan. The primary deliverable for attendees is an early stage consensus for i) architectural elements that can be fixed and ii) new materials, tools, devices and system integration concepts that will satisfy the 20-year IPSR-I projections for communication, computation, sensing and integrative AI applications. The meeting will establish the foundation for an E-P Integration Working Group to guide R&D and standards agreements.

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Host or Publisher AIM Photonics