San Diego Joint Chapters-iMaps & ACers- Lunch & Learn with Dr. Jeff Gotro

Title: Polymers for 5G Packaging Applications

Speaker bio: Dr. Jeff Gotro has over forty years’ experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell, National Starch Electronic Materials, and InnoCentrix, LLC. He has published 66 technical papers and 6 book chapters in the field of polymeric materials for advanced electronic packaging applications, holds 15 issued US patents, and has 4 patents pending. Jeff is a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) and was awarded the IMAPS John A. Wagnon Jr. Technical Achievement Award in 2014 for his numerous technical contributions relating to polymers used in electronic packaging. Jeff holds a B.S. in Mechanical Engineering/Materials Science from Marquette University and a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science.

The Details:

The presentation will cover the key polymer properties for advanced 5G packaging applications. Applications such as antenna-in-package and low loss packaging substrates require polymers and polymer composites with low dielectric loss factor (Df). The emergence of high frequencies used in 5G mobile communications in the 24-77 Ghz range requires polymer dielectrics with extremely low Df in the range of 0.002. The presentation will discuss strategies to obtain low dielectric loss factors and highlight commercially available materials.

QP Technologies: Meeting Sponsor

QP Technologies, a division of Promex Industries, provides U.S.-based semiconductor assembly and packaging services for prototype and volume production. Its capabilities include die attach, wire bonding, flip chip, stacked die, wafer preparation, multi-chip modules, system-in-package assembly, substrate development, and custom IC packaging. QP Technologies supports aerospace and defense, medical, automotive, industrial, power semiconductor, compound semiconductor, and commercial applications. With extensive engineering and manufacturing expertise, QP Technologies delivers customized solutions, including quick-turn assembly, for complex semiconductor packaging requirements.

Date: 09/09/2026

Time: 11:45am- 1:00pm

Location:

AI Technology (Formerly EMD Performance Materials)

6555 Nancy Ridge Dr.

San Diego, CA 92121

• $25 members / $30 non-members / Free for students with ID (Includes lunch)
• Please invite your friends and students - we always welcome new faces

We look forward to seeing you there!