InterPACK 2026: Packaging and Integration of Electronic and Photonic Microsystems
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InterPACK is the leading global forum for cutting‑edge research, development, manufacturing, and applications in electronics packaging and heterogeneous integration.
As the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK brings together the full systems ecosystem — from advanced materials and thermal management to next‑generation computing architectures and intelligent, connected devices. The program spans Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive and Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid, and Electric Vehicles.
https://event.asme.org/InterPACK?utm_medium=social&utm_source=facebook&utm_audience=b2c&utm_dept=cf&utm_campaign=interpack_cfa_organicsocial
As the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK brings together the full systems ecosystem — from advanced materials and thermal management to next‑generation computing architectures and intelligent, connected devices. The program spans Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive and Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid, and Electric Vehicles.
https://event.asme.org/InterPACK?utm_medium=social&utm_source=facebook&utm_audience=b2c&utm_dept=cf&utm_campaign=interpack_cfa_organicsocial
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Where is it happening?
San Diego Marriott Mission Valley, 8757 Rio San Diego Drive,San Diego, California, United States
Event Location & Nearby Stays:
Know what’s Happening Next — before everyone else does.
Host or PublisherASME (American Society of Mechanical Engineers)
