Mastering ANSYS Simulation (Mechanical & CFD): Advanced IC Packaging & FEA

💰 Training Fee: RM1,500 (Inclusive of meals & certificate)

This 3-day hands-on training by MIMOS Academy is designed to strengthen participants’ practical skills in ANSYS Mechanical and CFD simulation, with a focus on Advanced IC Packaging applications.

Participants will learn how to perform structural, thermal, warpage, and fluid-flow simulations using industry-standard methodologies. The programme emphasizes practical workflows, model setup, meshing techniques, solver configuration, and result interpretation based on real engineering scenarios.

Led by experienced consultants from CAD-IT Consultants, the training bridges theoretical knowledge with industrial practice through guided exercises and real-world case studies commonly used in semiconductor reliability and packaging analysis.

This programme is suitable for engineers, researchers, and technical professionals who wish to enhance their simulation capability and confidently apply ANSYS tools in real-world semiconductor and electronics design environments.

Know what’s Happening Next — before everyone else does.

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Host or Publisher MIMOS Services Sdn Bhd