Europe Data Center Cooling and Thermal Management Forum 2026

Schedule

Mon, 09 Nov, 2026 at 09:00 am to Tue, 10 Nov, 2026 at 05:00 pm

UTC+01:00
Location

Frankfurt, Germany | Frankfurt, Germany, HE

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Join us on November 9-10, 2026 in Frankfurt, Germany, where industry leaders, technology innovators, and decision-makers will come...
About this Event

In the digital age, AI always on, and data centers never off. As rack power moves toward 600 kW and cooling accounts for up to 40% of total energy consumption, the data center industry faces an unprecedented challenge: delivering uninterrupted, efficient operations for the explosive growth of Generative AI. Traditional air cooling is reaching its limits, regulatory frameworks across Europe demand greater sustainability, and ultra-high-density computing is reshaping every aspect of data center design—this is where the future of thermal management is forged.


Join us on November 9-10, 2026 in Frankfurt, Germany, at the – where industry leaders, technology innovators, and decision-makers come together to shape the next generation of resilient, efficient, and scalable cooling solutions for the AI era.


��25+ expert speakers–real conversations, real case studies

��20+ deep-dive sessions across 2 days

��200+ attendees across the value chain

��10+ hours of dedicated networking with decision-makers


Our agenda spans the entire thermal ecosystem–from chip-level emulation and liquid cooling architectures to site selection, waste heat recovery, and grid constraints. What you will learn:

1, Scale Liquid Cooling–From Direct‑to‑Chip and immersion to hybrid architectures–real-world deployment strategies.

2, Optimize PUE & WUE–Practical approaches to reduce energy and water usage while meeting tightening EU regulations (EnEFG, 42nd BImSchV).

3, Retrofit for AI Workloads–How to upgrade legacy air‑cooled facilities for high‑density GPU computing using CFD and modular designs.

4, Unlock Waste Heat Revenue–Integrate data center heat recovery into urban energy systems–turning a cost into a profit center.

5, Prepare for Next‑Gen Chips–Thermal challenges of 1800W‑2000W class processors and how to design“liquid‑first”infrastructure.

6, Navigate Grid & Water Constraints–Site selection, power availability, and resilience planning for extreme weather and capacity expansion.


This forum gathers a high-level audience across the ecosystem. Already confirmed delegates include:


AtlasEdge, Data4, Vantage Data Centers, Green Mountain, Telehouse, Maincubes, Mainova WebHouse, GreenScale, Kevlinx, nLighten, STACK Infrastructure, Yondr, Portus Data Centers, Apple ApS, Daikin, Danfoss, ebm-papst, HYDAC, Rittal, Wilo, Siemens, ABB, Eaton, Nidec, Atlas Copco, Sensata Technologies, Vaisala, Endress+Hauser, Shell, Molex, Johnson Controls, INWATEC GmbH & Co. KG, DYNACAST, Yokogawa, Nalco Danmark ApS, API Heat Transfer, Grundfos GmbH, E+E Elektronik Deutschland GmbH, Watson Marlow Fluid Technology Solutions, DBI Plastics Group A/S, Salute

…and many more. Full list available on the event website.


For more information and registration, contact the organizing team or visit the official event website.

Website link: https://www.ecv-events.com/EDCCTMF2026?cci=33

Email: [email protected]


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Where is it happening?

Frankfurt, Germany, Frankfurt, Germany, Frankfurt, Germany

Event Location & Nearby Stays:

Tickets

EUR 1000.00 to EUR 1800.00

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Host or PublisherBAO ZUN

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