35th Annual Electronics Packaging Symposium- Small Systems Integration

IBM Research, GE Research, IEEC and CAMM at Binghamton University invite you to attend this two-day event on September 4 and 5, 2024 at the Center of Excellence at Binghamton University in Binghamton NY. Registration closes on August 29, 2024, no walk-ins are allowed.

This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics.

• Future of Computing for HPC and AI

• Photonics Packaging

• Power Electronics

• Thermal Challenges / Harsh Environments

• Flexible & Additive Electronics

• Heterogeneous Integration

• Advance Substrates

• Wearable and Flexible Electronics for Medical Applications

Agenda : https://www.binghamton.edu/ieec/eps/agenda.html

Join us for two days filled with exciting discussions, workshops, and networking opportunities in the field of electronics packaging. Learn from industry experts, researchers, and fellow enthusiasts as we delve into the latest trends and innovations shaping the future of electronic packaging. Whether you're a seasoned professional or just starting out, this symposium promises to be a valuable experience for all attendees. Don't miss out on this fantastic opportunity to expand your knowledge and connect with like-minded individuals. See you there!

You can view the speaker list here:

https://www.binghamton.edu/ieec/eps/infoforspeakersandsessionchairs.html

If you have any questions, please contact us at: [email protected]

REGISTER TODAY and join a community which seeks advancement in the electronics packaging field. We look forward to seeing you this fall.

Sincerely,

2024 EPS Organizing Committee

Host or Publisher Integrated Electronics Engineering Center (IEEC)